Compliant wirebond pedestal

Details Compliant wirebond pedestal Compliant wirebond pedestal

2007-05-08

2007-05-08

Lee, Calvin (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257S786000

Reexamination Certificate

active

11096410

ABSTRACT:
A wire bonder (900) with a rigid pedestal (902) having resilient inserts (920). A package (904) placed on the pedestal (902) contains an electrical device (906). The bond pads on the electrical device (906) are electrically connected to bond pads on the package (904) by a series of bond wires (908) through use of a well know bonding process. A vacuum source holds the package (904) against the pedestal (902) deforming the resilient strips (920) located in the rigid member (902) of the pedestal and ensuring good contact between the ground pads of the package (904) and conductive resilient members (920). The resilient members (920) are conductive and electrically connect the package grounds to a system ground (922).

REFERENCES:
patent: 4143868 (1979-03-01), Bergman
patent: 5324012 (1994-06-01), Aoyama et al.
patent: 5496775 (1996-03-01), Brooks
patent: 5639694 (1997-06-01), Diffenderfer et al.
patent: 5661089 (1997-08-01), Wilson
patent: 5686353 (1997-11-01), Yagi et al.
patent: 6039831 (2000-03-01), Mine et al.
patent: 6048254 (2000-04-01), Duescher
patent: 6085962 (2000-07-01), Jacobson et al.
patent: 6169330 (2001-01-01), Pankove

Affiliated with

Also associated with

Rating

Compliant wirebond pedestal does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Compliant wirebond pedestal, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Compliant wirebond pedestal will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3811886