LandOfFree - US Patents - Listing for Semiconductor device manufacturing: process,Coating with electrically or thermally conductive material

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Ultra high-speed chip interconnect using free-space dielectrics

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Ultra low k plasma CVD nanotube/spin-on dielectrics with...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – Insulated gate formation

Ultra narrow lines for field effect transistors

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – Insulated gate formation

Ultra short transistor channel length dictated by the width...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Ultra thin FET

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – Insulated gate formation

Ultra thin spacers formed laterally adjacent a gate conductor re

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Ultra thin, single phase, diffusion barrier for metal...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Ultra-late programming ROM and method of manufacture

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Ultra-low loop wire bonding

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – Insulated gate formation

Ultra-low sheet resistance metal/poly-si gate for deep sub-micro

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Ultra-low temperature Al fill for sub-0.25 .mu.m generation of I

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Ultra-thick metal-copper dual damascene process

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Ultra-thin resist and silicon/oxide hard mask for metal etch

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Ultra-uniform silicides in integrated circuit technology

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Ultrathin chemically grown oxide film as a dopant diffusion...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Under bump metallization pad and solder bump connections

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Under bump metallurgy structural design for high reliability...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Under-bump metallization layers and electroplated solder...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Undercut-free BLM process for Pb-free and Pb-reduced C4