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Resin encapsulation type semiconductor device having an improved

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Resin mold semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Patent

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Resin mold type semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate

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Resin mold type semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Resin molded semiconductor device on a lead frame and method...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate

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Resin molded semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
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Resin molded type semiconductor device and a method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Resin molded type semiconductor device having a metallic plate s

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Resin molding part and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Resin sealed semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Resin sealed semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
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Resin sealed semiconductor device having power source by-pass co

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
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Resin sealed semiconductor device including a die pad uniformly

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Patent

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Resin sealed semiconductor device including multiple current det

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Resin sealed type semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Resin sealed type semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Resin sealing type semiconductor device and method of making the

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Patent

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Resin sealing type semiconductor device and method of making the

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Resin sealing type semiconductor device having thin portions for

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Patent

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Resin sealing type semiconductor device that includes a pluralit

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
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