Resin encapsulation type semiconductor device having an improved

Details Resin encapsulation type semiconductor device having an improved Resin encapsulation type semiconductor device having an improved

1993-10-22

1995-05-30

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257673, 257691, H01L 2348

Patent

active

054204593

ABSTRACT:
A resin encapsulation type semiconductor device is provided with first leads electrically connected to the signal terminals of a semiconductor element and plate-like conductor elements electrically connected to the power source terminals of the semiconductor element. The first leads and the plate-like conductor elements are arranged in parallel with each other to form a two-layer structure. The number of the leads of the semiconductor element of the invented semiconductor device is reduced from that of the leads of the conventional semiconductor device. At least one through hole is formed in each of the plate-like conductor elements in a power source lead frame so as to make the flow distribution more uniform than in the plate-like conductor elements without the through holes.

REFERENCES:
patent: 4680613 (1987-07-01), Daniels et al.
patent: 4862246 (1989-08-01), Masuda et al.
patent: 4942452 (1990-07-01), Kitano et al.
patent: 5084753 (1992-01-01), Goida et al.
patent: 5089878 (1992-02-01), Lee
patent: 5126823 (1992-06-01), Otsuka et al.
patent: 5196725 (1993-03-01), Mita et al.
patent: 5220195 (1993-06-01), McShane et al.
patent: 5281849 (1994-01-01), Singh Deo et al.
patent: 5283717 (1994-02-01), Hundt
patent: 5294902 (1994-03-01), Pannenborg et al.
patent: 5331200 (1994-07-01), Teo et al.

Affiliated with

Also associated with

Rating

Resin encapsulation type semiconductor device having an improved does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resin encapsulation type semiconductor device having an improved, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin encapsulation type semiconductor device having an improved will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-364515