Resin sealed semiconductor device having power source by-pass co

Details Resin sealed semiconductor device having power source by-pass co Resin sealed semiconductor device having power source by-pass co

1993-02-22

1994-01-04

LaRoche, Eugene R.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257668, 257787, H01L 2348, H01L 2312

Patent

active

052763528

ABSTRACT:
A resin sealed semiconductor device having: a semiconductor chip having an electric circuit therein and an elongated main connection line respectively formed thereon; a plurality of leads disposed near the chip; electrical connecting wires for electrically connecting together the chip and the leads; at least one by-pass connection line formed in correspondence with the main connection line; and by-pass connecting wires for electrically connecting the main connection line near at one end thereof to the by-pass connection line near at one end thereof, and electrically connecting the main connection line near at the other end thereof to the by-pass connection line near at the other end thereof.

REFERENCES:
patent: 4595945 (1986-06-01), Graver
patent: 4612564 (1986-09-01), Moyer
patent: 4934820 (1990-06-01), Takahashi et al.

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