Resin sealed semiconductor device

Details Resin sealed semiconductor device Resin sealed semiconductor device

1997-05-13

1999-06-08

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257676, 257782, 257787, H01L 2348

Patent

active

059106816

ABSTRACT:
In a resin-sealed semiconductor device, a semiconductor chip is mounted to a bed having a greater surface than that of the semiconductor chip. A lead section is comprised of a plurality of leads having their forward end portions arranged at given intervals around the semiconductor chip over the bed. The respective lead is connected by the tie bar to the bed. The bed, semiconductor chip, tie bars and portions of the leads are resin-sealed in a mold in such a way that a given surface side of the bed is exposed to an outside.

REFERENCES:
patent: 5317191 (1994-05-01), Abe
patent: 5343076 (1994-08-01), Katayama et al.

Affiliated with

Also associated with

Rating

Resin sealed semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resin sealed semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin sealed semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1684857