Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent
1994-08-15
1995-06-27
Jackson, Jerome
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
257692, 257698, 257787, H01L 2348, H01L 2940, H01L 2944
Patent
active
054282489
ABSTRACT:
A resin molded semiconductor package of which the semiconductor chip is bonded to leads instead of a paddle. This package comprises a semiconductor chip and a lead frame comprising a plurality of board connection leads and a plurality of chip connection leads. The board connection leads are connected to a circuit board and support the semiconductor chip bonded to their surfaces. The chip connection leads extend from individual board connection leads and are electrically connected to the semiconductor chip through a plurality of metal wires. A pair of chip bonding materials bond the semiconductor chip to the surfaces of the board connection leads. A predetermined volume of the package, including the semiconductor chip and the board connection leads and the chip connection leads, is hermetically sealed by a mold resin to form a package body in which the lower surfaces of the board connection leads are exposed to the outside of the lower surface of the package body. The chip bonding material is selected from an insulating double-faced tape and an insulating adhesive of the paste type.
REFERENCES:
patent: 5122860 (1992-06-01), Kikuchi et al.
patent: 5172214 (1992-12-01), Casto
patent: 5235207 (1993-08-01), Ohi et al.
patent: 5250841 (1993-10-01), Sloan et al.
Goldstar Electron Co. Ltd.
Jackson Jerome
Monin, Jr. Donald L.
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