Resin sealed type semiconductor device

Details Resin sealed type semiconductor device Resin sealed type semiconductor device

1994-10-05

1995-10-17

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257692, 257724, H01L 2316

Patent

active

054593506

ABSTRACT:
A resin sealed semiconductor device includes a current-detecting resistance for detecting current flowing in a semiconductor element that is a metallic resistance having a coefficient of thermal expansion almost equal to that of the lead frame. Compared to a conventional ceramic chip resistance, its coefficient of thermal expansion differs less from that of the lead frame, thereby preventing deterioration caused by heat stress.

REFERENCES:
patent: 5173762 (1992-12-01), Ota et al.
patent: 5229640 (1993-07-01), Pak
patent: 5287083 (1994-02-01), Person et al.

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