Resin sealed semiconductor device

Details Resin sealed semiconductor device Resin sealed semiconductor device

1996-04-08

1997-08-19

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257666, H01L 2302, H01L 23495

Patent

active

056591993

ABSTRACT:
A resin sealed semiconductor device includes a lead frame having a die pad; a semiconductor element mounted on the die pad; a resin sealing the lead frame and the semiconductor element, the die pad including a plurality of through holes where the semiconductor element is mounted; and a resin film bonding the semiconductor element to the die pad.

REFERENCES:
patent: 4952999 (1990-08-01), Robinson et al.

Affiliated with

Also associated with

Rating

Resin sealed semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resin sealed semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin sealed semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1106972