Resin sealing type semiconductor device and method of making the

Details Resin sealing type semiconductor device and method of making the Resin sealing type semiconductor device and method of making the

1996-02-26

1998-09-01

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

257787, 257793, 257796, 257784, H01L 23495, H01L 2328, H01L 2329

Patent

active

058014357

ABSTRACT:
A resin sealing type semiconductor device includes a semiconductor element having electrodes and a fixing surface, and a heat radiator for cooling the semiconductor element. The heat radiator includes a mounting surface on which the semiconductor element is mounted. A bonding layer is formed on the mounting surface between the semiconductor element and the heat radiator. The planar dimension of the bonding layer is smaller than that of the fixing surface of the semiconductor element. The semiconductor element adheres to the bonding layer through an adhesive layer. A resin package seals the semiconductor element, the heat radiator, and parts of leads and wires.

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