Resin sealing type semiconductor device and method of making the

Details Resin sealing type semiconductor device and method of making the Resin sealing type semiconductor device and method of making the

1995-06-05

1997-05-27

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257691, 257698, 257784, H01L 23495

Patent

active

056335296

ABSTRACT:
The invention provides a resin sealing type semiconductor device and fabrication method thereof. The resin sealing type semiconductor device has good heat radiation characteristics and high reliability. A highly flexible wiring arrangement design is provided by using leads commonly. The resin sealing type semiconductor device includes an element mounting portion having an element mounting surface. A semiconductor element is bonded to the element mounting surface. A plurality of leads is provided and is separated from the semiconductor element, a frame lead is disposed between these leads and the semiconductor element and not in contact with either the semiconductor element or the leads. Wires are provided for electrical connections and a resin seals the element mounting portion, the semiconductor element, parts of the leads and the frame lead.

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Marcus Kamezos et al; EDQUAD--An Enhanced Performance Plastic Package; IEEE, Jan. 5, 1994; pp. 63-66.

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