Resin sealing type semiconductor device having thin portions for

Details Resin sealing type semiconductor device having thin portions for Resin sealing type semiconductor device having thin portions for

1996-03-14

1998-07-07

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

257706, 257707, 257796, 257674, H01L 23495, H01L 2310, H01L 2334, H01L 2328

Patent

active

057773807

ABSTRACT:
A resin sealing type semiconductor device includes a radiator, a semiconductor element, a frame lead arranged at a distance around this semiconductor element and displaced from the radiator, and a plurality of leads extending from this frame lead and attached to a mounting surface with a insulating lead support therebetween. The leads are pressed downward by an upper mold so that the radiator is pressed against a lower mold in such a manner that resin cannot seep therebetween. Thin portions are formed in the leads to ensure that the leads do not peel away from the insulating lead support.

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Karnezos, M. et al., "EDQUAD -- An Enhanced Performance Plastic Package," Proceedings of the Electronic Components and Technology Conference, Institute of Electrical and Electronics Engineers, 1994, pp. 63-66.

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