Resin sealed semiconductor device including a die pad uniformly

Details Resin sealed semiconductor device including a die pad uniformly Resin sealed semiconductor device including a die pad uniformly

1996-08-14

1998-05-19

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With dam or vent for encapsulant

257668, 257687, 257714, H01L 2334, H01L 2330, H01L 2348

Patent

active

057539693

ABSTRACT:
A semiconductor chip having a plurality of electrodes on its surface is fixed onto a die pad. The leads are spaced away from the die pad and connected to the electrodes of the semiconductor chip by means of a TAB tape. The die pad is substantially equal in size to the insulation film of the TAB tape. The die pad has a plurality of resin circulating holes around the semiconductor chip. The resin circulating holes are arranged such that a fluid resin sufficiently flows into a narrow area between the TAB tape and die pad. On the die pad, portions each between adjacent resin circulating holes serves as heat conducting paths. The heat generated from the semiconductor chip is transmitted to the entire region of the die pad through the heat conducting paths and then radiated outside.

REFERENCES:
patent: 3905038 (1975-09-01), Beyerlein
patent: 4390598 (1983-06-01), Phy
patent: 5193053 (1993-03-01), Sohobe
patent: 5225710 (1993-07-01), Westerkamp
patent: 5231755 (1993-08-01), Emanuel
patent: 5237202 (1993-08-01), Shimizu et al.
patent: 5248895 (1993-09-01), Nakazawa
patent: 5256900 (1993-10-01), Hashizume et al.
patent: 5291060 (1994-03-01), Shimizu et al.
patent: 5554885 (1996-09-01), Yamasaki et al.

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