Resin molded type semiconductor device having a metallic plate s

Details Resin molded type semiconductor device having a metallic plate s Resin molded type semiconductor device having a metallic plate s

1992-04-24

1992-12-29

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257783, H01L 2328, H01L 2944, H01L 3902, H01L 2302

Patent

active

051756102

ABSTRACT:
A semiconductor chip is attached to the upper surface of a bed formed of a metallic plate. Lead terminals are connected to terminal portions of the semiconductor chip by bonding wires. A plurality of bridge-shaped projections are formed on the lower surface of the bed, by punching a material which constitutes the bed. The portions including the bed, semiconductor chip and projections are molded and sealed with mold resin. In this case, the mold resin is filled in the space defined by the bridge portions which constitute the projections.

REFERENCES:
patent: 4994895 (1991-02-01), Matsuzaki et al.
patent: 5001542 (1991-03-01), Tsukagoshi et al.
patent: 5001547 (1991-03-01), Luigi
patent: 5019673 (1991-05-01), Juskey et al.
patent: 5045151 (1991-09-01), Edell

Affiliated with

Also associated with

Rating

Resin molded type semiconductor device having a metallic plate s does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resin molded type semiconductor device having a metallic plate s, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin molded type semiconductor device having a metallic plate s will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1891340