Resin mold type semiconductor device

Details Resin mold type semiconductor device Resin mold type semiconductor device

1997-02-12

1998-03-03

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257686, 257692, 257787, H01L 23495

Patent

active

057239002

ABSTRACT:
A ultra thin resin mold semiconductor device can be provided. A resin mold type semiconductor device is arranged so that a semiconductor chip is disposed within a range of the thickness of a lead frame and sealed with a resin mold, that the thickness of the semiconductor device is defined by the thickness of the lead frame, and that an upper surface, a lower surface and a side surface of a terminal portion formed by the lead frame are exposed from the surface of the resin mold.

REFERENCES:
patent: 5157475 (1992-10-01), Yamaguchi
patent: 5519251 (1996-05-01), Sato et al.

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