Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2011-07-26
2011-07-26
Louie, Wai-Sing (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
Reexamination Certificate
active
07986031
ABSTRACT:
A primary molding product is formed by integrally forming a first lead frame and a second lead frame with a primary molding resin portion. In addition, in order to prevent separation of the first lead frame and the second lead frame from the primary molding resin portion, a hook-and-hold portion for preventing separation of the first lead frame from the primary molding resin portion and separation of the second lead frame from the primary molding resin portion is provided on an outer surface of each of the first lead frame and the second lead frame. Thus, a resin molding part capable of achieving suppression of increase in a thickness thereof without deformation or displacement of a lead frame and a manufacturing method thereof can be provided.
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Abe Tomonori
Awano Yuhei
Fujita Akihiro
Iinuma Hideo
Inuzuka Takayuki
Louie Wai-Sing
Mitsubishi Electric Corporation
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
Tang Sue
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