Resin sealed type semiconductor device

Details Resin sealed type semiconductor device Resin sealed type semiconductor device

1993-06-14

1995-02-21

Limanek, Robert P.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257666, 257668, 257787, 361737, H01L 2348, H01L 2944

Patent

active

053919165

ABSTRACT:
A semiconductor device of a structure in which lateral surfaces of a semiconductor element and an element supporting member are bonded to each other without resorting to use of a base member on which the semiconductor element is disposed. Since thicknesses of the base member and a bonding resin provides no contribution to overall thickness of the semiconductor device, reduction of thickness thereof by 30 to 40% is made possible. In dependence on configuration of the element supporting member, the semiconductor device can be applied to large size elements, lead-on-chip structure (LOC) and others.

REFERENCES:
patent: 3708730 (1973-01-01), Schierz et al.
patent: 4137546 (1979-01-01), Frusco
patent: 4635092 (1987-01-01), Yerman et al.
patent: 4680613 (1987-07-01), Daniels et al.
patent: 4766478 (1988-08-01), Dennis
patent: 4816427 (1989-03-01), Dennis
patent: 4916506 (1990-04-01), Gagnon
patent: 4984062 (1991-01-01), Vemura et al.
patent: 4985748 (1991-01-01), Belanger, Jr.

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