Resin mold semiconductor device

Details Resin mold semiconductor device Resin mold semiconductor device

1993-09-27

1994-11-15

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With stress relief

257676, 257730, H01L 2348

Patent

active

053651065

ABSTRACT:
A first lead frame A has an island 21 on which a semiconductor chip 24 is mounted. The major surface of the island that is opposite to the major surface on which the semiconductor chip 24 is mounted is exposed to the outside of a resin member. A second lead frame B includes a distortion preventing member 26 having substantially the same shape as the island 21 of the first lead frame A. The major surface of the distortion preventing member 26 that is opposite to the major surface facing the island 21 is exposed to the outside of the resin member. The semiconductor chip 24 is located between the island 21 and the distortion preventing member 26. Thus, the semiconductor device has low thermal resistance, and its final shape has no distortion.

REFERENCES:
patent: 5173764 (1992-12-01), Higgins, III
patent: 5223739 (1993-06-01), Katsumata et al.
patent: 5252783 (1993-10-01), Baird

Affiliated with

Also associated with

Rating

Resin mold semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resin mold semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin mold semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1099703