Chip on board with heat sink attachment

Chip on lead frame for small package speed sensor

Chip package

Chip package and electrical connection structure between...

Chip package enabling increased input/output density

Chip package having asymmetric molding

Chip package having with asymmetric molding and turbulent...

Chip package structure and fabricating method thereof

Chip package structure and manufacturing method thereof

Chip package with a dam structure on a die pad

Chip package with asymmetric molding

Chip packages with covers

Chip packaging

Chip scale package

Chip scale package having flip chip interconnect on die paddle

Chip scale package of semiconductor

Chip scale package with direct attachment of chip to lead frame

Chip scale package with heat spreader

Chip scale package with heat spreader

Chip support of a leadframe for an integrated circuit package