Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2008-05-27
2008-05-27
Clark, Jasmine J (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257S670000, C257S678000, C257S787000, C257S793000, C257SE23001, C257SE23007, C257SE23015, C324S160000, C324S161000, C324S162000, C324S163000, C324S164000, C324S165000
Reexamination Certificate
active
07378721
ABSTRACT:
A sensor package apparatus includes a lead frame substrate that supports one or more electrical components, which are connected to and located on the lead frame substrate. A plurality of wire bonds are also provided, which electrically connect the electrical components to the lead frame substrate, wherein the lead frame substrate is encapsulated by a thermoset plastic to protect the plurality of wire bonds and at least one electrical component, thereby providing a sensor package apparatus comprising the lead frame substrate, the electrical component(s), and the wire bonds, while eliminating a need for a Printed Circuit Board (PCB) or a ceramic substrate in place of the lead frame substrate as a part of the sensor package apparatus. A conductive epoxy can also be provided for maintaining a connection of the electrical component(s) to the lead frame substrate. The electrical components can constitute, for example, an IC chip and/or a sensing element (e.g., a magnetoresistive component) or sense die.
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Frazee Lawrence E.
Lamb Wayne A.
Patin John S.
Schelonka Peter A.
Stolfus Joel D.
Clark Jasmine J
Honeywell International , Inc.
Lopez Kermit D.
Ortiz Luis M.
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