Chip package with a dam structure on a die pad

Details Chip package with a dam structure on a die pad Chip package with a dam structure on a die pad

2008-11-11

2010-10-12

Chambliss, Alonzo (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S783000, C257S787000, C257SE23010, C257SE23014, C257SE23031, C257SE23145, C257SE23043, C257SE23141, C361S772000, C361S813000, C438S123000, C438S127000

Reexamination Certificate

active

07812432

ABSTRACT:
A chip package including a die pad, a plurality of leads, a chip, an adhesive, and a molding compound is provided. The die pad has a top surface and a bottom surface opposite to the top surface, wherein the die pad has a blocking portion disposed on the top surface, and the leads are disposed around the die pad. The chip is disposed on the top surface of the die pad surrounded by the blocking portion and is electrically connected to the leads. A top surface of the blocking portion is higher than the top surface of the die pad surrounded by the blocking portion. The adhesive is disposed between the chip and the die pad. The molding compound encapsulates the chip, a portion of the leads, and the die pad.

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