Chip support of a leadframe for an integrated circuit package

Details Chip support of a leadframe for an integrated circuit package Chip support of a leadframe for an integrated circuit package

2006-02-28

2008-08-12

Picardat, Kevin M (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S673000, C438S111000, C438S123000

Reexamination Certificate

active

07411280

ABSTRACT:
The central region of a leadframe (101, 201, 301, 401, 501, 601, 701, 801, 901, 1001, 1101, 1201), is selectively etched to leave upright portions (104, 204, 304, 404, 504, 604, 704, 804, 904, 1004, 1104, 1204). Subsequently, during the packaging process, an integrated circuit (3) is located on the central region of the leadframe, and wires (107) are formed between the upright portions of the leadframe and contacts (5) of the integrated circuit (3), which are to be grounded. Subsequently, the wires and upright portions of the leadframe are encased in resin (116). Since the upright portions of the leadframe are encased in resin, the resin (116) is mechanically locked to the leadframe. Furthermore, any delamination that occurs between the resin (116) and the leadframe cannot propagate easily up the sides of the upright portions as far as the wires (107), so the wires (107) are unlikely to be torn from the upright portions (104, 204, 304, 404, 504, 604, 704, 804, 904, 1004, 1104, 1204). Any adhesive that leaks from under the integrated circuit (3) when the integrated circuit (3) is mounted on the leadframe, is most unlikely to cover any part of the upper surface of the upright portions.

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