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2011-05-10

2011-05-10

Lebentritt, Michael S (Department: 2829)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S678000, C257S738000, C257SE23019, C257SE23039, C257SE23064, C257SE23173, C257SE25023, C257SE29022

Reexamination Certificate

active

07939918

ABSTRACT:
This invention discloses a crystalline substrate based device including a crystalline substrate having formed thereon a microstructure; and at least one packaging layer which is sealed over the microstructure by means of an adhesive and defines therewith at least one gap between the crystalline substrate and the at least one packaging layer. A method of producing a crystalline substrate based device is also disclosed.

REFERENCES:
patent: 2507956 (1950-05-01), Bruno et al.
patent: 2796370 (1957-06-01), Ostrander et al.
patent: 2851385 (1958-09-01), Spruance, Jr. et al.
patent: 4251852 (1981-02-01), Ecker et al.
patent: 4633573 (1987-01-01), Scherer
patent: 4894707 (1990-01-01), Yamawaki et al.
patent: 4908086 (1990-03-01), Goodrich et al.
patent: 4943844 (1990-07-01), Oscilowski et al.
patent: 5037779 (1991-08-01), Whalley et al.
patent: 5455386 (1995-10-01), Brathwaite et al.
patent: 5455455 (1995-10-01), Badehi
patent: 5505985 (1996-04-01), Nakamura et al.
patent: 5547906 (1996-08-01), Badehi
patent: 5610431 (1997-03-01), Martin
patent: 5660741 (1997-08-01), Suzuki et al.
patent: 5716759 (1998-02-01), Badehi
patent: 5719979 (1998-02-01), Furuyama
patent: 5798557 (1998-08-01), Salatino et al.
patent: 5824204 (1998-10-01), Jerman
patent: 5837562 (1998-11-01), Cho
patent: 5912592 (1999-06-01), Kikushima
patent: 5915168 (1999-06-01), Salatino et al.
patent: 5925973 (1999-07-01), Eda et al.
patent: 5969461 (1999-10-01), Anderson et al.
patent: 5980663 (1999-11-01), Badehi
patent: 5981945 (1999-11-01), Spaeth et al.
patent: 5996199 (1999-12-01), Ichikawa et al.
patent: 6018191 (2000-01-01), Murakami et al.
patent: 6062461 (2000-05-01), Sparks et al.
patent: 6083766 (2000-07-01), Chen
patent: 6087586 (2000-07-01), Chen
patent: 6106735 (2000-08-01), Kurle et al.
patent: 6111274 (2000-08-01), Arai
patent: 6168965 (2001-01-01), Malinovich et al.
patent: 6169319 (2001-01-01), Malinovich et al.
patent: 6214644 (2001-04-01), Glenn
patent: 6215642 (2001-04-01), Sogard
patent: 6245595 (2001-06-01), Nguyen et al.
patent: 6268231 (2001-07-01), Wetzel
patent: 6285064 (2001-09-01), Foster
patent: 6351027 (2002-02-01), Giboney et al.
patent: 6441453 (2002-08-01), Tindle
patent: 6475327 (2002-11-01), Tung et al.
patent: 6495398 (2002-12-01), Goetz
patent: 6507097 (2003-01-01), Goetz et al.
patent: 6686652 (2004-02-01), Bayan et al.
patent: 6700606 (2004-03-01), Borza
patent: 6716670 (2004-04-01), Chiang
patent: 2005/0189627 (2005-09-01), Ito et al.
patent: 2005/0189642 (2005-09-01), Bolken et al.
patent: 2005/0224956 (2005-10-01), Kao et al.
patent: 2006/0131747 (2006-06-01), Madrid
patent: 2007/0126103 (2007-06-01), Shi
patent: 2007/0210446 (2007-09-01), Andry et al.
patent: 2007/0267467 (2007-11-01), Burke et al.
patent: 2008/0191334 (2008-08-01), Lee et al.
patent: 2008/0211074 (2008-09-01), Osako et al.
patent: 0740852 (1996-11-01), None
patent: 0951062 (1999-10-01), None
patent: 05291388 (1993-11-01), None
patent: 06318625 (1994-11-01), None
patent: 09219423 (1997-08-01), None
patent: 11055069 (1999-02-01), None
patent: 11145316 (1999-05-01), None
patent: 11-326366 (1999-11-01), None
patent: WO-95/19645 (1995-07-01), None
patent: WO-97/45955 (1997-12-01), None
patent: 9940624 (1999-08-01), None
patent: WO-99/040624 (1999-08-01), None
EPO-TEK.RTM. 353ND Bond 1 Specifications, Epoxy Technology Inc., Billerica, Mass., rev. Jul. 1993, one page.
Nanu.RTM. SU-8 Features & Benefits, Micro Chem Corp, Newton, Mass., rev. May 1998, one page.
Nanu.RTM. SU-8 Resists & Specifications, Micro Chem Corp, Newton, Mass., rev. May 1998, 2 pages.
Office Action from corresponding Japanese Application 2001-543771 mailed Jun. 29, 2010.
Communication from corresponding EP Application No. 009798968 dated Aug. 9, 2010.

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