Chip scale package with heat spreader

Details Chip scale package with heat spreader Chip scale package with heat spreader

2007-06-19

2007-06-19

Graybill, David E. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With separate tie bar element or plural tie bars

C257S737000, C257S738000, C257S673000, C257S675000, C257S676000, C257S677000

Reexamination Certificate

active

09342789

ABSTRACT:
A dense semiconductor flip-chip device assembly is provided with a heat sink/spreading/dissipating member that is formed as a paddle of a metallic paddle frame in a strip of paddle frames. Semiconductor dice are bonded to the paddles by, e.g., conventional semiconductor die attachment methods, enabling bump attachment and testing to be conducted before detachment from the paddle frame strip.

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