Chip package structure and manufacturing method thereof

Details Chip package structure and manufacturing method thereof Chip package structure and manufacturing method thereof

2006-06-13

2006-06-13

Smith, Matthew S. (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

C257S720000, C257S717000, C438S122000

Reexamination Certificate

active

07061079

ABSTRACT:
The present invention provides a chip package structure and the manufacturing method thereof, which affords higher heat dissipation efficiency and is suitable to fabricate the stack type package structure with a higher integration. The chip package structure comprises a carrier, at least a chip, a heat sink and a mold compound. The chip is disposed on the carrier, while the bonding pads of the chip are electrically connected to the leads of the carrier. The heat sink is disposed over the chip and includes at least a body and a plurality of connecting portions. The connecting portions are disposed around a periphery of the body and are electrically connected to the leads. By using a specially designed heat sink, the chip package structure can afford better heat dissipation and be suitable to form stack type package structures.

REFERENCES:
patent: 6784023 (2004-08-01), Ball
patent: 6969640 (2005-11-01), Dimaano, Jr. et al.

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