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Assembly and methods for packaged die on pcb with heat sink...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Assembly for dissipatating heat from a semiconductor chip wherei

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Assembly for dissipating heat from a stacked semiconductor packa

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Assembly for mounting an electronic device having an optically e

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means
Patent

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Assembly for mounting power semiconductive modules to heat...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
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Assembly for stacked BGA packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Assembly of plurality of semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Assembly of semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Assembly package with stacked dies and signal transmission...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Assembly process

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Assembly structure of electronic element and heat sink

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Assembly with a ring and bonding pads formed of a same...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Asymmetric alignment of substrate interconnect to...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Attaching semiconductor dies to substrates with conductive...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Axial lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Back-face and edge interconnects for lidded package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Back-to-back semiconductor device assemblies

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Backside exposure of desired nodes in a multi-layer integrated c

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Ball array layout

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Ball array layout in chip assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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