Assembly for mounting an electronic device having an optically e

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means

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Details

257323, H01L 2978, H01L 3100

Patent

active

054101816

ABSTRACT:
An integrated circuit (106) having an optically erasable portion (114) is joined to a substrate (102) such that the optically erasable portion faces the substrate. The substrate (102) includes an aperture (104) that exposes the optically erasable portion (114) of the integrated circuit providing erasing capability to the integrated circuit (106). A plug (110) impermeable to light may be inserted into the aperture (104) to provide a sealed window to the optically erasable portion (114) of the integrated circuit (106).

REFERENCES:
patent: 4723156 (1988-02-01), Okuaki
patent: 4760440 (1988-07-01), Bigler et al.
patent: 5300808 (1994-04-01), Suppelsa
patent: 5311059 (1994-05-01), Banerji et al.

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