Back-face and edge interconnects for lidded package

Details Back-face and edge interconnects for lidded package Back-face and edge interconnects for lidded package

2007-05-29

2007-05-29

Tran, Minhloan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S680000, C257SE23002, C257SE23114, C257SE23194

Reexamination Certificate

active

10949844

ABSTRACT:
A packaged microelectronic device is provided which includes: (a) a unit having a chip with an upwardly-facing front surface and a downwardly-facing rear surface, a lid overlying at least a portion of the front surface of the chip, the lid having a top surface facing upwardly away from the chip and unit connections exposed at the top surface of the lid. At least some of the unit connections are electrically connected to the chip. The packaged microelectronic device also includes a package structure including structure defining package terminals, at least some of the package terminals being electrically connected to the chip. The package structure, the unit or both define a downwardly-facing bottom surface of the package, the terminals being exposed at the bottom surface.

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