Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2007-08-28
2007-08-28
Williams, Alexander Oscar (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257SE23075, C257SE23185, C257SE23069, C257SE23068, C257SE23190, C257SE25023, C257S772000, C257S706000, C257S707000, C257S712000, C257S713000, C257S434000, C257S458000, C257S479000, C257S460000, C257S788000, C257S797000, C257S734000, C257S787000, C257S710000, C257S728000, C385S093000, C385S052000, C385S091000, C361S718000, C174S257000
Reexamination Certificate
active
11038374
ABSTRACT:
An assembly includes a substrate, a device coupled to the substrate; a ring formed on the substrate; and one or more bonding pads formed on the substrate, wherein the ring and bonding pads are formed of a same material.
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Chen Chien-Hua
Craig David M.
Haluzak Charles C.
Yenchik Ronnie J.
Hewlett--Packard Development Company, L.P.
Williams Alexander Oscar
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