Assembly for dissipatating heat from a semiconductor chip wherei

Details Assembly for dissipatating heat from a semiconductor chip wherei Assembly for dissipatating heat from a semiconductor chip wherei

1997-12-19

1999-07-06

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257718, 257726, 257727, 257737, 257778, 257738, 361809, H01L 2334, H01L 2310

Patent

active

059201207

ABSTRACT:
An assembly comprising a substrate, a thermally conductive member which is spaced from the substrate, and a semiconductor chip located on a side of the substrate facing the thermally conductive member. A resilient component is compressed between the substrate and the thermally conductive member so that a force clamping the substrate and the thermally conductive member together is shared by at least the semiconductor chip and the component.

REFERENCES:
patent: 5065280 (1991-11-01), Karnezos et al.
patent: 5345102 (1994-09-01), Daikoku et al.
patent: 5500556 (1996-03-01), Kosugi
patent: 5592021 (1997-01-01), Meschter et al.
patent: 5719443 (1998-02-01), Messina
patent: 5754400 (1998-05-01), Sathe et al.

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