Assembly for dissipating heat from a stacked semiconductor packa

Details Assembly for dissipating heat from a stacked semiconductor packa Assembly for dissipating heat from a stacked semiconductor packa

1997-12-16

2000-07-18

Chaudhuri, Olik

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257668, 257686, 257706, 257712, 257723, 257724, H01L 2334, H01L 23495, H01L 2310

Patent

active

060911425

ABSTRACT:
A stacked semiconductor package and a method for assembling the same are disclosed, the stacked semiconductor package including a semiconductor chip having a plurality of wire bonding pads thereon; leads formed in a direction to electrically connect with the wire bonding pads; a heat sink connected to the predetermined wire bonding pad to radiate out heat of the semiconductor chip; and an epoxy supporting and protecting the semiconductor chip, the leads, and the heat sink.

REFERENCES:
patent: 5471011 (1995-11-01), Maslakow
patent: 5757075 (1998-05-01), Kitaoka
patent: 5773879 (1998-06-01), Fusayasu et al.

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