Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1993-03-09
1994-05-31
Jackson, Jerome
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257666, 257667, 257670, 257692, 257459, 257786, H01L 2348, H01L 2940, H01L 2302, H01L 2312
Patent
active
053171896
ABSTRACT:
An axial lead frame including two side rails arranged opposite to each other and plural pairs of lead terminals separated from each other and located opposite to each other, in which a longer lead terminal and a shorter lead terminal of a pair of the lead terminals are alternately arranged to extend in parallel with each other in the equally spaced relationship between both side rails. And, a buffer member is formed at the substantially central part between both the side rails so as to allow the longer lead terminals extending from both the side rails toward the buffer member to be jointed to each other along the buffer member. A die pad is die-bonded to the foremost end of each of the longer lead terminal, while a pad is placed at the foremost end of each of the shorter lead terminal. Dam bars are bridged between adjacent lead terminals in order to prevent molten resin from flowing out during molding operation.
REFERENCES:
patent: 4694183 (1987-09-01), Merrick et al.
patent: 4984057 (1991-01-01), Mii
W. E. Dougherty, Connection of Discrete Leads to Packaged Circuits, Jan. 1972, 2435, IBM TDB.
Shimazaki Eiji
Tsuji Kazuyoshi
Arroyo T. M.
Jackson Jerome
Rohm & Co., Ltd.
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