Assembly structure of electronic element and heat sink

Details Assembly structure of electronic element and heat sink Assembly structure of electronic element and heat sink

2005-11-23

2009-08-04

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S707000, C257S711000, C257S713000, C257S717000, C257S718000, C257S719000, C257SE23084, C257SE23101

Reexamination Certificate

active

07569928

ABSTRACT:
An assembly structure of an electronic element and a heat sink is disclosed. An assembly structure of an electronic element and a heat sink comprises a fastening element, an electronic element having a first through hole, and an insulating piece having a second through hole, an insulating element disposed in the first through hole of the electronic element and having a channel therein, and a heat sink. The second through hole is disposed correspondingly to the first through hole of the electronic element, the electronic element and the insulating piece are secured on the heat sink by inserting the fastening element through the channel of the insulating element, so as to insulate the electronic element from the heat sink by the insulating element.

REFERENCES:
patent: 3641474 (1972-02-01), Owens
patent: 3801874 (1974-04-01), Stefani
patent: 4460917 (1984-07-01), Rogers
patent: 5592021 (1997-01-01), Meschter et al.

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