Back-to-back semiconductor device assemblies

Details Back-to-back semiconductor device assemblies Back-to-back semiconductor device assemblies

2007-10-16

2007-10-16

Soward, Ida M. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S686000, C257S723000, C257S724000, C257S725000, C257S726000, C257S777000, C257S778000

Reexamination Certificate

active

10933027

ABSTRACT:
A back-to-back semiconductor device assembly includes two vertically mountable semiconductor devices, the backs of which are secured to one another. The bond pads of both semiconductor devices are disposed adjacent a single, mutual edge of the assembly. The semiconductor devices may include semiconductor dice, or they may be devices that have yet to be separated from other devices carried by the same substrates.

REFERENCES:
patent: 4922378 (1990-05-01), Malhi et al.
patent: 5259793 (1993-11-01), Yamada et al.
patent: 5291061 (1994-03-01), Ball
patent: 5323060 (1994-06-01), Fogal et al.
patent: 5327325 (1994-07-01), Nicewarner, Jr.
patent: 5327327 (1994-07-01), Frew et al.
patent: RE34794 (1994-11-01), Farnworth
patent: 5362986 (1994-11-01), Angiulli et al.
patent: 5397747 (1995-03-01), Angiulli et al.
patent: 5444304 (1995-08-01), Hara et al.
patent: 5450289 (1995-09-01), Kweon et al.
patent: 5451815 (1995-09-01), Taniguchi et al.
patent: 5483024 (1996-01-01), Russell et al.
patent: 5491612 (1996-02-01), Nicewarner, Jr.
patent: 5530292 (1996-06-01), Waki et al.
patent: 5545922 (1996-08-01), Golwalkar et al.
patent: 5552596 (1996-09-01), Ravetto et al.
patent: 5567654 (1996-10-01), Beilstein et al.
patent: 5574310 (1996-11-01), Sono et al.
patent: 5592019 (1997-01-01), Ueda et al.
patent: 5593927 (1997-01-01), Farnworth et al.
patent: 5616962 (1997-04-01), Ishikawa et al.
patent: 5635757 (1997-06-01), Stockmeier et al.
patent: 5635760 (1997-06-01), Ishikawa
patent: 5637828 (1997-06-01), Russell et al.
patent: 5646446 (1997-07-01), Nicewarner et al.
patent: 5656553 (1997-08-01), Leas et al.
patent: 5661901 (1997-09-01), King
patent: 5668409 (1997-09-01), Gaul
patent: 5714802 (1998-02-01), Cloud et al.
patent: 5719438 (1998-02-01), Beilstein et al.
patent: 5757080 (1998-05-01), Sota
patent: 5767443 (1998-06-01), Farnworth et al.
patent: 5786628 (1998-07-01), Beilstein et al.
patent: 5790380 (1998-08-01), Frankeny
patent: 5790381 (1998-08-01), Derouiche et al.
patent: 5793108 (1998-08-01), Nakanishi et al.
patent: 5793116 (1998-08-01), Rinne et al.
patent: 5801448 (1998-09-01), Ball
patent: 5814881 (1998-09-01), Alagaratnam et al.
patent: 5874774 (1999-02-01), Takahashi
patent: 5892287 (1999-04-01), Hoffman et al.
patent: 5910682 (1999-06-01), Song
patent: 5936840 (1999-08-01), Satwinder
patent: 5956236 (1999-09-01), Corisis et al.
patent: 5965933 (1999-10-01), Young et al.
patent: 5995378 (1999-11-01), Farnworth et al.
patent: 6007357 (1999-12-01), Perino et al.
patent: 6021048 (2000-02-01), Smith
patent: 6080931 (2000-06-01), Park et al.
patent: 6088237 (2000-07-01), Farnworth et al.
patent: 6091145 (2000-07-01), Clayton
patent: 6121676 (2000-09-01), Solberg
patent: 6140696 (2000-10-01), Kinsman
patent: 6147411 (2000-11-01), Kinsman
patent: 6191474 (2001-02-01), Kinsman et al.
patent: 6232659 (2001-05-01), Clayton
patent: 6235551 (2001-05-01), Farnworth et al.
patent: 6380630 (2002-04-01), Kinsman
patent: 6383839 (2002-05-01), Kinsman
patent: 6465275 (2002-10-01), King et al.
patent: 6507109 (2003-01-01), Kinsman
patent: 6784023 (2004-08-01), Ball
patent: 6800942 (2004-10-01), Kinsman
patent: 6873037 (2005-03-01), Kinsman
patent: 221496 (1987-05-01), None
patent: 62260354 (1987-11-01), None
patent: 62293749 (1987-12-01), None
patent: 63099558 (1988-04-01), None
patent: 63099560 (1988-04-01), None
patent: 03173167 (1991-07-01), None
patent: 03255657 (1991-11-01), None
patent: 04320361 (1992-11-01), None
patent: 04320362 (1992-11-01), None
patent: 05075016 (1993-03-01), None
patent: 05090486 (1993-04-01), None
patent: 6-77392 (1994-03-01), None
patent: 06177323 (1994-06-01), None

Affiliated with

Also associated with

Rating

Back-to-back semiconductor device assemblies does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Back-to-back semiconductor device assemblies, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Back-to-back semiconductor device assemblies will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3834565