LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Thermally enhanced electronic flip-chip packaging with...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermally enhanced electronic flip-chip packaging with...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermally enhanced flip chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Thermally enhanced high density semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Thermally enhanced integrated circuit packaging system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermally enhanced metal capped BGA package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermally enhanced micro-ball grid array package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Thermally enhanced molded package for semiconductors

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Thermally enhanced molded package for semiconductors

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermally enhanced package for an integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With housing mount

Thermally enhanced packaged semiconductor assemblies

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Thermally enhanced semiconductor chip having integrated...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Thermally enhanced semiconductor chip having integrated...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermally enhanced semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Thermally enhanced semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermally enhanced semiconductor package and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Thermally enhanced stacked die package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermally enhanced stacked die package and fabrication method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Thermally enhanced tape ball grid array package