Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2007-04-17
2007-04-17
Ho, Tu-Tu (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S686000, C257S707000, C257S777000, C257S796000, C257SE23102
Reexamination Certificate
active
10825910
ABSTRACT:
A substrate is provided. A first die is attached to the substrate. The first die is electrically connected to the substrate. A heat sink having an undercut around its periphery is attached to the first die. A second die is attached to the heat sink. The second die is electrically connected to the substrate, and the first die, the heat sink, and the second die are encapsulated.
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Ahn Byung Hoon
Do Byung Tai
Ho Tu-Tu
Ishimaru Mikio
ST Assembly Test Services Ltd.
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