Thermally enhanced semiconductor package

Details Thermally enhanced semiconductor package Thermally enhanced semiconductor package

2006-05-02

2006-05-02

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S707000, C257S710000, C257S712000, C257S713000, C257S720000, C257S783000

Reexamination Certificate

active

07038311

ABSTRACT:
A thermally enhanced BGA semiconductor device10having a heat sink12formed from a single piece of material with an expanded base and a pedestal in contact with a semiconductor chip11.The pedestal is aligned through a window opening in a substrate13and the top surface of the base is adhered to the substrate. The heat sink12with an expanded base provides a path for rapid and efficient heat spreading and dissipation, a stand-off and an aid to improved package planarity during reflow to a PCB, and a long path for ingress of contaminants into the package. The device is amenable to high volume, low cost production.

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patent: 5644163 (1997-07-01), Tsuji
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patent: 62-52949 (1987-03-01), None
patent: 63-136655 (1988-06-01), None
patent: 6-61386 (1994-03-01), None

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