Thermally enhanced integrated circuit packaging system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257692, 257693, 257697, 257712, 257707, H01L 2940, H01L 2348, H01L 2350

Patent

active

059397810

ABSTRACT:
The present invention is a thermally enhanced integrated circuit packaging system that can be produced using standard assembly tooling and equipment and that provides increased heat dissipation with little or no additional cost. The present invention provides novel enhanced internal and external thermal pathways from the die to the ambient. In one embodiment, unused and grounded leads are joined internally by webs between individual leads, forming a wide heat conduction path which is directly connected to the die pad. This heat conduction path enhances heat flow from the die to the exterior of the integrated circuit package. In addition, a second set of webs joins the leads at their exterior ends, providing an enhanced thermal path externally from the integrated circuit package to the printed circuit board, and from there to the ambient environment. In another embodiment of the invention, heat dissipation from the integrated circuit package is further enhanced by mounting it on a printed circuit board comprising a ground plane to which the webbed external leads are directly connected. Because of the increased heat transfer between the integrated circuit die and the printed circuit board provided by the present invention, the ground plane on the printed circuit board acts as a heat sink, dissipating heat conducted to the ground plane through the webbed leads. The present invention is fabricated using the same tools and equipment as standard, unenhanced integrated circuit packaging.

REFERENCES:
patent: 4392152 (1983-07-01), Hirano
patent: 4989066 (1991-01-01), Sumi
patent: 5281849 (1994-01-01), Singh Deo et al.
patent: 5334872 (1994-08-01), Ueda et al.
patent: 5384286 (1995-01-01), Hirai
patent: 5394751 (1995-03-01), Ishibashi

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thermally enhanced integrated circuit packaging system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermally enhanced integrated circuit packaging system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermally enhanced integrated circuit packaging system will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-317285

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.