Thermally enhanced package for an integrated circuit

Details Thermally enhanced package for an integrated circuit Thermally enhanced package for an integrated circuit

2007-12-25

2007-12-25

Chambliss, Alonzo (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S707000, C257S713000, C257S717000, C257S720000, C257SE23101, C361S704000, C361S709000, C361S712000

Reexamination Certificate

active

11345104

ABSTRACT:
A circuit assembly having an insulating base, a heat-conducting plate and a circuit containing die is disclosed. The die is in thermal contact with the heat-conducting plate, which is bonded to the insulating base. The insulating base includes heat-conducting channels that are in thermal contact with the heat-conducting plate. The die includes an integrated circuit therein and is mounted such that the heat-conducting plate is disposed between the die and the insulating plate. The insulating base preferably includes signal conducting channels for providing electrical connections to the die, the heat-conducting plate having an opening therein for making the connections between the die and the conducting channels. The assembly may also include a heat-spreading cover in thermal contact with the heat-conducting base plate, the heat-spreading cover overlying the die. The heat-conducting channels are preferably filled with solder, and include a solder protrusion extending from the heat-conducting channels.

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