Thermally enhanced flip chip package

Details Thermally enhanced flip chip package Thermally enhanced flip chip package

1997-04-24

1999-03-16

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257712, 257720, 257778, 257796, H01L 2310, H01L 2334, H01L 2348, H01L 2352

Patent

active

058834303

ABSTRACT:
A thermally conductive planar member is in thermally conductive communication with a flip chip encapsulated within a dielectric material that surrounds portions of the thermally conductive planar member, the flip chip, and a predefined portion of a substrate member. The present invention provides a flip chip package having pick-and-place capability without the thermal resistance disadvantage of capped chip packages.

REFERENCES:
patent: 5404273 (1995-04-01), Akagawa
patent: 5510956 (1996-04-01), Suzuki
patent: 5619070 (1997-04-01), Kozono
patent: 5625226 (1997-04-01), Kinzer
patent: 5672548 (1997-09-01), Culnane et al.

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