Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2006-11-08
2009-06-30
Purvis, Sue (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257SE23101
Reexamination Certificate
active
07554194
ABSTRACT:
A semiconductor package has a substrate having a first surface, a second surface, and a through hole opening. A heat spreader has a first surface, a second surface, and a plurality of notches formed on the second surface. A semiconductor die is coupled to the first surface of the heat spreader. The semiconductor die is electrically coupled to the substrate. An encapsulant is used to cover portions of the first surface of the substrate, portions of the first surface of the heat spreader, and the semiconductor die. A first set of solder balls is coupled to the second surface of the substrate. A second set of solder balls is coupled to the second surface of the heat spreader wherein the second set of solder balls is located in the notches.
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Jang Chang Ho
Kelly Michael G.
Lee Ki Wook
Amkor Technology Inc.
Purvis Sue
Soderholm Krista
Weiss & Moy P.C.
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