Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1998-06-15
1999-12-14
Saadat, Mahshid
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257693, 257701, 257707, H01L 2348, H01L 2312, H01L 23053
Patent
active
060021691
ABSTRACT:
A semiconductor package (110) includes a tape substrate (135) having a top surface, a bottom surface, a plurality of conductive metal traces (115) formed on the top surface and a plurality of holes (130) arraigned in an array pattern formed through the tape substrate (135) exposing the conductive traces (115) from the bottom surface. A nonconductive metal plate or stiffener frame (155) attached to the bottom surface of the tape substrate (135) to support the tape substrate (135) during assembly. The stiffener frame (155) having through holes (160) corresponding to the holes (130) in the tape substrate (135) and being made from anodized aluminum, thus making it electrically nonconductive. An integrated circuit (IC) chip (120) is mounted on the top surface, opposite the stiffener frame (155). The IC chip (120) is in electrical connection to the traces (115) and a plurality of solder balls (125) are attached to the traces (115) through the holes (130 and 160), electrically connecting the semiconductor package (110) to a printed circuit board (170). Along with providing support for the tape substrate (135) during assembly, the stiffener frame (155) is used to improve the thermal performance of the semiconductor package (110) by dissipating the heat generated by the IC die (120) and improving the flatness of the finished semiconductor package (110).
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Chia Chok J.
Lim Seng-Sooi
Low Owai H.
Clark Jhihan B.
LSI Logic Corporation
Saadat Mahshid
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