Thermally enhanced micro-ball grid array package

Details Thermally enhanced micro-ball grid array package Thermally enhanced micro-ball grid array package

1995-08-22

1998-08-04

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257707, 257712, 257778, H01L 2312, H01L 2310, H01L 2334, H01L 2348

Patent

active

057898090

ABSTRACT:
An integrated circuit package includes a die and an electrically conductive cap attached to the top surface of the die. The die has a top surface, a bottom surface, an edge surface, a plurality of input/output terminals on the bottom surface of the die, and an input/output terminal pad on the top surface of the die. An electrically conductive arrangement is electrically connected to the input/output terminals on the bottom surface of the die providing an arrangement for electrically connecting the input/output terminals on the bottom surface of the die to other electrical elements. The electrically conductive cap attached to the top surface of the die provides an arrangement for electrically connecting the input/output terminal on the top surface of the die to other electrical elements and may be used to provide improved heat dissipation from the die.

REFERENCES:
patent: 3449640 (1969-06-01), Franklin
patent: 5016138 (1991-05-01), Woodman
patent: 5409865 (1995-04-01), Karnezos

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