Thermally enhanced molded package for semiconductors

Details Thermally enhanced molded package for semiconductors Thermally enhanced molded package for semiconductors

2008-04-22

2008-04-22

Zarneke, David A (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257SE23083

Reexamination Certificate

active

10974658

ABSTRACT:
An integrated circuit package (50) is provided which comprises a substrate (20), an integrated circuit (12) mounted on the substrate, and a compressive, thermally conductive interposer (52) mounted on the integrated circuit.

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