Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2006-07-31
2011-10-18
Lee, Eugene (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S711000, C257S712000, C257S722000
Reexamination Certificate
active
08039951
ABSTRACT:
This invention includes a heat sink structure for use in a semiconductor package that includes a ring structure with down sets and a heat sink connected to the ring structure. The down sets can be slanted or V-shaped. The invention also includes a method of manufacturing a semiconductor package that includes inserting a substrate with an attached semiconductor chip in a first mold portion, placing a heat sink structure on top of a portion of the substrate, placing a mold release film onto a second mold portion, clamping a second mold portion onto a portion of the heat sink structure, injecting an encapsulant into a mold cavity, wherein the encapsulant surrounds portions of the substrate, semiconductor chip and heat sink structure, curing the encapsulant, whereby the heat sink structure adheres to the encapsulant and singulating the encapsulated assembly to form a semiconductor package.
REFERENCES:
patent: 5822848 (1998-10-01), Chiang
patent: 6049125 (2000-04-01), Brooks et al.
patent: 6229702 (2001-05-01), Tao et al.
patent: 6246115 (2001-06-01), Tang et al.
patent: 6288900 (2001-09-01), Johnson et al.
patent: 6316717 (2001-11-01), Corisis et al.
patent: 6432749 (2002-08-01), Libres
patent: 6538321 (2003-03-01), Huang et al.
patent: 6552428 (2003-04-01), Huang et al.
patent: 7009283 (2006-03-01), de Simone et al.
patent: 7410830 (2008-08-01), Fan et al.
patent: 7468548 (2008-12-01), Wu et al.
patent: 2002/0074627 (2002-06-01), Combs
patent: 2002/0195701 (2002-12-01), Bemmerl et al.
patent: 2003/0057545 (2003-03-01), Shim et al.
patent: 2003/0134437 (2003-07-01), Lo et al.
patent: 2003/0160323 (2003-08-01), Tong et al.
patent: 2007/0138614 (2007-06-01), Harrison et al.
patent: 11-074439 (1999-03-01), None
patent: 2004/032186 (2004-04-01), None
Hoong Patrick Low Tse
Kanth Kolan Ravi
Retuta Danny Vallejo
Sheng Anthony Sun-Yi
Tan Hien Boon
Ho Anthony
Lee Eugene
Sughrue & Mion, PLLC
United Test and Assembly Center Ltd.
LandOfFree
Thermally enhanced semiconductor package and method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thermally enhanced semiconductor package and method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermally enhanced semiconductor package and method of... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4292765