Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With housing mount
Patent
1996-11-04
2000-06-13
Williams, Alexander Oscar
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With housing mount
257704, 257708, 257778, 257699, 257731, 257737, 257707, H01L 2302, H01L 2312, H01L 2328, H05K 506
Patent
active
060752890
ABSTRACT:
A thermally enhanced semiconductor package includes a sheet metal cap having flexible flanges provided with solder contacts for reliable attachment to a circuit board. The package assembly further includes a semiconductor chip with a contact-bearing front surface facing forwardly, and chip bonding contacts overlying the front face of the chip. The flange bonding contacts are coplanar with the chip bonding contacts, or can be brought into coplanar alignment by flexure of the cap. The package can be surface-mounted to a circuit board by placing the package onto pads of solder paste, and then heating the assembly to melt the solder paste in order to join the bonding contacts on the chip and on the flange to corresponding contacts on the circuit board.
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Tessera Inc.
Williams Alexander Oscar
LandOfFree
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