LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

IC chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

IC chip package having chip attached to and wire bonded within a

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Device held in place by clamping

IC chip package having force-adjustable member between...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

IC chip packaging for reducing bond wire length

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

IC chip, antenna, and manufacturing method of the IC chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

IC die power connection using canted coil spring

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

IC die with directly bonded liquid cooling device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

IC interconnect

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

IC memory card

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

IC memory card, host device and connecting system of IC memory c

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

IC module and a data carrier employing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

IC module and IC card

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

IC package and LSI package using a lead frame formed of a copper

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

IC package capable of accommodating discrete devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

IC package having a single wiring sheet with a lead pattern disp

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

IC package having direct attach backup battery

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

IC package having replaceable backup battery

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

IC package pressure release apparatus and method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

IC package structure for achieving better heat dissipation