Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent
1992-07-29
1994-05-17
Mintel, William
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
257686, 257784, H01L 2302
Patent
active
053130960
ABSTRACT:
An IC chip package includes a chip having an upper active surface thereof bonded to the lower surface of a substrate. A plurality of terminals on the active surface are wire bonded within the outer periphery of the chip by bonding wires extending through a plurality of apertures in a lower layer of the substrate to bonding pads on an upper surface of the lower substrate layer. Metallized strips couple the bonding pads to conductive pads at the outer edges of the lower substrate layer. The substrate includes an upper layer having apertures therein. After wire bonding, the apertures in the upper and lower substrate layers are filled with epoxy which is cured and then ground flush with the upper surface of the upper substrate layer. The chip is then lapped to a desired thickness, following which the chip package is electrically tested at various temperatures. The chip package is programmed by wire bonding a chip enable trace to one of a plurality of optional bonding pads of a bonding option array on the lower substrate layer, following which an aperture within the upper substrate layer which provides access to the bonding option array is filled with epoxy which is then cured and ground flat at the upper surface of the substrate. The chip package may then be assembled together with other chip packages into a stack, with the conductive pads of the substrates being joined by strip soldering to form vertical conductive columns.
REFERENCES:
patent: 3959579 (1976-05-01), Johnson
patent: 4379259 (1983-04-01), Varadi et al.
patent: 4956694 (1990-09-01), Eide
patent: 4996587 (1991-02-01), Hinrichsmeyer et al.
patent: 5041395 (1991-08-01), Steffen
patent: 5086018 (1992-02-01), Conru et al.
patent: 5107328 (1992-04-01), Kinsman
patent: 5155068 (1992-10-01), Tada
Dense-Pac Microsystems, Inc.
Mintel William
Potter Roy
LandOfFree
IC chip package having chip attached to and wire bonded within a does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with IC chip package having chip attached to and wire bonded within a, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and IC chip package having chip attached to and wire bonded within a will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-879273