IC package having direct attach backup battery

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Patent

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Details

257691, 257692, 257787, 257924, 257666, 365229, 365228, H01L 2348, H01L 2302, H01L 2312, G11C 700

Patent

active

052948293

ABSTRACT:
A molded device package supports a volatile memory chip and a replaceable backup battery for preserving data in the event of loss of main power supply. The package includes an external socket for receiving a replaceable backup battery which can be manually inserted into or removed from the socket after molding encapsulation and metal trim work have been completed. The socket is intersected by an exposure cavity which permits the positive and negative terminals of a backup battery to engage positive and negative finger leads. The positive and negative battery terminals are engaged by resilient terminal contact portions of the positive and negative finger leads which project into the exposure cavity. Socket shoulder portions and a retainer cap hold a backup battery within the socket and in electrical contact with the resilient terminal contact portions.

REFERENCES:
patent: 4763308 (1988-08-01), Morata
patent: 4992987 (1991-02-01), Echols et al.
patent: 5055704 (1991-10-01), Link et al.
Electronics, "Designer's Dream Machine-Dallas Semiconductor's Microcontroller Updates Itself on the Fly", by Bernard C. Cole, Mar. 5, 1987.

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