Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2010-11-03
2011-12-13
Clark, Sheila V (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S777000
Reexamination Certificate
active
08076768
ABSTRACT:
A multi-tiered IC device contains a first die including a substrate with a first and second set of vias. The first set of vias extends from one side of the substrate, and the second set of vias extend from an opposite side of the substrate. Both sets of vias are coupled together. The first set of vias are physically smaller than the second set of vias. A second die having a set of interconnects is stacked relative to the first die in which the interconnects couple to the first set of vias.
REFERENCES:
patent: 3577037 (1971-05-01), Di Pietro et al.
patent: 3648131 (1972-03-01), Stuby
patent: 4074342 (1978-02-01), Honn et al.
patent: 6400008 (2002-06-01), Farnworth
patent: 6599778 (2003-07-01), Pogge
patent: 7354798 (2008-04-01), Pogge
patent: 7638869 (2009-12-01), Irsigler et al.
patent: 7786008 (2010-08-01), Do et al.
patent: 2008/0073752 (2008-03-01), Asai
patent: 2008/0157361 (2008-07-01), Wood et al.
patent: 2008/0258259 (2008-10-01), Osaka et al.
patent: 2010/0148371 (2010-06-01), Kaskoun
patent: 2010/0181589 (2010-07-01), Huang et al.
patent: 2133909 (2009-12-01), None
patent: 2008035261 (2008-03-01), None
patent: 2008120418 (2008-09-01), None
International Search Report—PCT/ US2009/067682, International Search Authority—European Patent Office May 11, 2010.
Written Opinion—PCT/ US2009/067682, International Search Authority—European Patent Office May 11, 2010.
Kommera S et al: “Novel through-die connections for MEMS applications” XP9022355, Database accession No. 7764513, Database Inspec [Online], The Institution of Electrical Engineers, Stevenage, GB; 2003, & Micromachining and Microfabrication Process Technology VII Jan. 27-29, 2003 San Jose, CA, USA, vol. 4979, 2003, pp. 261-270, Proceedings of the SPIE—The International Society for Optical Engineering SPIE—Int. Soc. Opt. Eng USA, LNKD—doi:10.1117/12.472804, ISSN: 0277-786X.
Gu Shiqun
Kaskoun Kenneth
Swinnen Bart
Clark Sheila V
Gallardo Michelle
QUALCOMM Incorporated
Talpalatsky Sam
Velasco Jonathan T.
LandOfFree
IC interconnect does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with IC interconnect, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and IC interconnect will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4260308